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  • Our COB/COF/MCM Center provides bonding and die-on-die packaging services for applications including but not limited to: DSP, MP5, SD cards, SIM cards, flash memory, computer peripherals, medical equipment, and finger print lock
  • Equipment Used: more than 40 sets of ASM automatic ultrasonic wire bonders, golden ball wire bonders, and automatic high precision die attach machines
  • Engineering Ability: Fast COB sample build base on MPW wafers, stacked package and ultrathin glob
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