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Your present location: HomeServices > Grinding Sawing & Sorting

Grinding Sawing & Sorting

  • Equipment Used: high precision automatic grinders, automatic wafer sawing machines, automatic pick and place machines, precise metallographic microscopes, and ultra pure water systems
  • Engineering Ability: Fast sawing of MPW wafers, COB sample process
  • Production Capability: Grinding, sawing, and sorting of 12, 8, and 6-inch wafers
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